We are pleased to announce the successful deployment of the radiation-tolerant Distributed I/O Tier (DI/OT) for the pilot run conducted by the TE-MPE group earlier this year. This milestone represents a key step in the WIC2 (Warm magnet Interlock Controller v2) renovation project, with the system now installed in the TI2 transfer line.

The current pilot setup includes one DI/OT crate - integrating the radiation-tolerant System Board, HydRA, SoC,  FMC nanoFIP, and RaToPUS power supply unit, all designed by the EDL section. Additionally, it features two I/O modules developed by the TE-MPE group.

The installation also features a complete WorldFIP infrastructure to connect 17 DI/OT devices and one ProFIP unit – a Profinet-to-WorldFIP translator which is an integral part of the EDL DI/OT hardware kit. Simultaneously, the TE-MPE group is conducting a validation of the full system configuration – comprising the ProFIP and 17 DI/OT crates – in their Meyrin lab.

This very first pilot deployment is a crucial step towards the full-scale TI2 rollout planned during the technical stop later this year. Throughout 2025, the DI/OT-based WIC2 system will operate in parallel with the legacy PLC-based WIC to gain operational experience. A full transition to the DI/OT-based WIC2 is scheduled for the upcoming YETS (Year-End Technical Stop).

This achievement is the result of a collaborative effort between the TE-MPE group and several sections from our BE-CEM group: EDL – DI/OT project lead, hardware and gateware design, and system support; EPR – radiation qualification and hardware modules production, IN – WorldFIP infrastructure deployment and asset management; MTA – development of Production Test Suites for DI/OT hardware modules.